Company Story
1968 - Amkor Technology, Inc. was founded as a semiconductor packaging company.
1970 - Introduced the first plastic dual in-line package (PDIP) for microprocessors.
1980 - Developed the first quad flat package (QFP) for microprocessors.
1990 - Listed on the NASDAQ stock exchange under the ticker symbol AMKR.
1995 - Acquired several companies, expanding its presence in Asia and Europe.
2000 - Introduced the first wafer-level chip scale package (WLCSP) for mobile devices.
2005 - Acquired Taiwan-based ChipMOS Technologies, expanding its manufacturing capabilities.
2010 - Introduced the first fan-out wafer-level packaging (FOWLP) for mobile devices.
2015 - Acquired Nanium S.A., a Portuguese semiconductor company.
2020 - Introduced the first heterogeneous integration (HI) technology for 5G and AI applications.