Company Story
1951 - Kulicke and Soffa Industries, Inc. was founded by Dr. George Kullcke and Dr. N. Soffa
1953 - The company developed its first wire bonder, the Model 1100
1961 - Kulicke and Soffa Industries, Inc. went public with an initial public offering (IPO)
1970 - The company introduced its first automatic wire bonder, the Model 1400
1980 - Kulicke and Soffa Industries, Inc. expanded its product line to include flip chip bonders
1990 - The company introduced its first ball bonder, the Model 1480
2000 - Kulicke and Soffa Industries, Inc. acquired AssembleTech, a provider of semiconductor assembly equipment
2008 - The company acquired STATS ChipPAC, a leading provider of semiconductor packaging and test services
2015 - Kulicke and Soffa Industries, Inc. acquired LitePoint, a provider of wireless test solutions